BNL Tech Notes

Thermal simulation of the EIC HSR interconnect module - RF fingers

Tech Note Information

Electron-Ion Collider (EC)
BNL-225645-2024-TECH
225645
5/14/2024
Submittal Date
5/21/2024

Author Information

F. Micolon
Bellon, J; Hetzel, C; Sangroula, M; Verdu-Andres, S.
PARTICLE ACCELERATORS
EIC-ADD-TN-095